Biography

EDUCATION

2021 – present                   PhD candidate, LAAS, CNRS
2018 – 2019                       Visiting Master student, Harvard University
2016 – 2019                       MSc in Microengineering, École Polytechnique Fédérale de Lausanne
2012 – 2016                       BSc in Electrical engineering, TU Vienna

INTERNSHIPS AND PROJECTS

2018 – 2019                       Master’s thesis, Harvard University, Lewis Research Group

Design, development of a fabrication method and of a silicon – based microfabricated printhead for a novel form of droplet generation – acoustophoretic printing.

2018                                   Six – month Internship, Sensirion AG

Development and characterization of particulate matter sensors, design of experiments, behavior simulation, measurement automatization.

2017                                   Semester project, EPFL, LMIS1

Exploration of silk fibroin as a thermal resist for applications in t-SPL and subsequently for pattern transfers into SiO2. Proof of concept study was made on the exploitation of a reversible change of protein secondary structure in microfabrication.

2017                                   Semester project, EPFL, Optics Laboratory

Modification and adaptation of the existing learning tomography method for 3D modelling of cells and microbeads.

2016                                   Summer Internship, Infineon Technologies AG

Measurement and characterization of trench transistors from a production line exhibiting atypical behavior. The collected data was used by Infineon for the improvement of their products.

2015                                   Bachelor’s thesis, TU Vienna, Institute of Sensors and Actuator Systems
Evaluation and comparison of different thin film metallization systems targeted for the integration in Surface Acoustic Wave devices operated under high temperature conditions.